Low Pressure Injection Molding Solution We Re-Design the Overmolding Industry Standard
Simplified Process, High Consistency, Excellent Structural
Process UP, Design UP, Value UP
Low pressure injection molding products have the function of structural, optimize the structural design and improve the functionality at the same time, help to realize product aesthetics.
What is Low Pressure Injection Molding?
Low pressure injection molding is an innovative manufacturing process between injection molding and potting. It is injection molding at very low pressures and very low temperature with hot melt adhesives. It is a cost effective alternative to epoxy potting for protection of fragile electronic components. It offers superior strain relief compared to conventional plastic injection molding. Typically benefit of superior material properties of water-tight encapsulation with excellent Physical Properties & Chemical Properties.
1.5 bar
Very low pressure to protect the electronic components
150 ℃
Very low temperature with good adhesion with PCB
5 s
Very fast cycle time to improve the productivity
Advantages
Flexible structural design to support diverse assembly requirements
Sealing, water-proof, anti-seismic, stress relief and simplified production process
Achieve commonality and consistency of parts, to achieve the quantifiable production
Improve the structure function of the product, to realize product aesthetics
Functions
Flexible structural design to support diverse assembly requirements.
Sealing, water-proof, anti-seismic, stress relief and simplified production process.
Achieve commonality and consistency of parts, to achieve the quantifiable production.
Improve the structure function of the product, to realize product aesthetics.
PCB Full Protection Simple assembly, waterproof and sealing
PCB Selective Protection Improve productivity and product consistency
FPC Protection Properly protectsensitive IC, fit for assembling
External Fixation Simple assembly, waterproof and sealing
Internal Fixation Improving Welding Efficiency
Assembling Structural Parts Protection chip, fast installation
Internal Model Protection Protect components, fixed wire harness
Internal Filling of Products Good fluidity and excellent adhesion
Protection of Solder Joints Nice appearance and high efficiency
Materials for Wide Variety of Applications
Hot melt adhesive (thermoplastic polyamide resin) has a wide variety of applications. With a variety of substrates have excellent adhesion, low viscosity, high insulation strength, wide operating temperature range, excellent weather resistance, with UL standards.Single component material, extracted from plants; no chemical reaction, no harmful substances in use, with EU ROHS standard.
1000 hours
Double 85 testing
Insulation
Chemical resistant
UV resistant
Elongation 700
RTI 95°
-50℃+200℃
UL94V0
ROHS
SGS
Environmental
Please contact our technical sales, we’ll recommend suitable materials for you depends on your applications.
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